NDLI: Material transfer controlled by elastomeric layer thickness

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Material transfer controlled by elastomeric layer thickness

Content Provider	Royal Society of Chemistry (RSC)
Author	Bartlett, Michael D. Crosby, Alfred J.
Copyright Year	2014
Abstract	Transferring material components across substrates through the control of interfacial adhesion is important for electronics, biology and other fabrication processes. Here we show a transfer mechanism which controls adhesive force through the thickness of supported elastomeric substrates. This is experimentally demonstrated by transferring millimeter and centimeter scale wafers to progressively thinner substrates without any specific actuation, chemical treatment, or surface topography. We extend this methodology by selectively transferring objects with sub-surface patterns and demonstrate how thickness control can enable roll-to-roll material transfer processes. These experiments are supported by a theoretical model which demonstrates how this mechanism is governed by the geometric confinement of the interface, where adhesive force is increased by decreasing the thickness of the elastomeric substrate relative to the lateral dimension of the transferred object. This simple, glueless approach allows for the precise control of adhesive force capacity as well as a mechanism to greatly enhance adhesive strength.
Starting Page	507
Ending Page	512
Page Count	6
File Format	HTM / HTML PDF
ISSN	20516347
Volume Number	1
Issue Number	5
Journal	Materials Horizons
DOI	10.1039/c4mh00106k
Language	English
Publisher	Royal Society of Chemistry
Access Restriction	Open
Subject Keyword	Biology Roll-to-roll processing
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Materials Science Electrical and Electronic Engineering Process Chemistry and Technology

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