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| Content Provider | Royal Society of Chemistry (RSC) |
|---|---|
| Author | Jones, John R. Barton, John M. Liu, Shuyuan Hamerton, Ian Howlin, Brendan J. |
| Copyright Year | 1996 |
| Abstract | A commercial epoxy prepolymer (MY750) was cured with novel modified imidazole curing agents under both isothermal and dynamic scanning conditions. The incorporation of an imidazole–copper(II) chloride complex curing agent to the epoxy prepolymer effected full cure after an isothermal cure schedule and post-cure treatment. The thermal stability of polymers arising from the isothermal cure schedule were generally higher than those for the corresponding dynamic cure. For samples cured via the dynamic curing process, a lower heating rate resulted in superior thermal stability. The same findings were obtained for samples cured via the isothermal curing process where the lower initial cure temperatures were optimal. The results of the present study show that the addition of metal atoms to the polymer systems does not have an adverse effect on either the water absorption or the dielectric properties of the final product. The cured resin displayed comparable thermal stability and absorbed the same amount of water at saturation (and a marginally lower amount at lower curing agent loadings) to a similar sample cured with an unmodified imidazole adduct. |
| Starting Page | 305 |
| Ending Page | 310 |
| Page Count | 6 |
| File Format | |
| ISSN | 09599428 |
| Volume Number | 6 |
| Issue Number | 3 |
| Journal | Journal of Materials Chemistry |
| DOI | 10.1039/JM9960600305 |
| Language | English |
| Publisher | Royal Society of Chemistry |
| Access Restriction | Open |
| Subject Keyword | Epoxy Prepolymer Imidazole Isothermal process Chloride Polymer Dielectric The Cured Resin Adduct |
| Content Type | Text |
| Resource Type | Article |
| Subject | Chemistry Materials Chemistry |
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