NDLI: A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

Content Provider	PubMed Central
Author	Luo, Zhenyu Chen, Deyong Wang, Junbo Li, Yinan Chen, Jian
Copyright Year	2014
Abstract	This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this paper. In this device, the pressure under measurement causes a deflection of a pressure-sensitive silicon square diaphragm, which is further translated to stress build up in “H” type doubly-clamped micro resonant beams, leading to a resonance frequency shift. The device geometries were optimized using FEM simulation and a 4-inch SOI wafer was used for device fabrication, which required only three photolithographic steps. In the device fabrication, a non-evaporable metal thin film as the getter material was sputtered on a Pyrex 7740 glass wafer, which was then anodically bonded to the patterned SOI wafer for vacuum packaging. Through-glass via holes predefined in the glass wafer functioned as the electrical interconnections between the patterned SOI wafer and the surrounding electrical components. Experimental results recorded that the Q-factor of the resonant beam was beyond 22,000, with a differential sensitivity of 89.86 Hz/kPa, a device resolution of 10 Pa and a nonlinearity of 0.02% F.S with the pressure varying from 50 kPa to 100 kPa. In addition, the temperature drift coefficient was less than −0.01% F.S/°C in the range of −40 °C to 70 °C, the long-term stability error was quantified as 0.01% F.S over a 5-month period and the accuracy of the microsensor was better than 0.01% F.S.
Related Links	http://dx.doi.org/10.3390/s141224244
Ending Page	24257
Page Count	14
Starting Page	24244
File Format	PDF
ISSN	14248220
e-ISSN	14248220
Journal	Sensors (Basel, Switzerland)
Issue Number	12
Volume Number	14
Language	English
Publisher	MDPI
Publisher Date	2014-12-01
Access Restriction	Open
Rights Holder	MDPI
Subject Keyword	Electrical and Electronic Engineering Analytical Chemistry Atomic and Molecular Physics, and Optics Biochemistry Research in Higher Education
Content Type	Text
Resource Type	Article
Subject	Medicine Atomic and Molecular Physics, and Optics Instrumentation Analytical Chemistry Biochemistry Information Systems Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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