NDLI: Microfluidic Packaging Integration with Electronic-Photonic Biosensors Using 3D Printed Transfer Molding

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Microfluidic Packaging Integration with Electronic-Photonic Biosensors Using 3D Printed Transfer Molding

Content Provider	MDPI
Author	Vladimir, Stojanović Adamopoulos, Christos Gharia, Asmaysinh Niknejad, Ali Anwar, Mekhail
Copyright Year	2020
Description	Multiplexed sensing in integrated silicon electronic-photonic platforms requires microfluidics with both high density micro-scale channels and meso-scale features to accommodate for optical, electrical, and fluidic coupling in small, millimeter-scale areas. Three-dimensional (3D) printed transfer molding offers a facile and rapid method to create both micro and meso-scale features in complex multilayer microfluidics in order to integrate with monolithic electronic-photonic system-on-chips with multiplexed rows of 5 $μ$ m radius micro-ring resonators (MRRs), allowing for simultaneous optical, electrical, and microfluidic coupling on chip. Here, we demonstrate this microfluidic packaging strategy on an integrated silicon photonic biosensor, setting the basis for highly multiplexed molecular sensing on-chip.
Starting Page	177
e-ISSN	20796374
DOI	10.3390/bios10110177
Journal	Biosensors
Issue Number	11
Volume Number	10
Language	English
Publisher	MDPI
Publisher Date	2020-11-14
Access Restriction	Open
Subject Keyword	Biosensors Analytical Chemistry Integrated Photonics Microfluidics Packaging Photonic Biosensors Optical Resonators Multiplexed Sensing 3d Printing
Content Type	Text
Resource Type	Article

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