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Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire
| Content Provider | MDPI |
|---|---|
| Author | Kamiya, Osamu Takahashi, Mamoru Miyano, Yasuyuki Ito, Shinichi Nakatsu, Masanobu Mizuma, Hiroyuki Iwama, Yuichi Murata, Kenji Nanao, Junpei Kawano, Makoto Maisawa, Arata Kazumi, Takashi |
| Copyright Year | 2022 |
| Description | This study demonstrates that a single-crystal diamond substrate can be cut along designed lines using the diamond-saw-wire cutting method. We developed an original saw-wire fixed diamond-grain using a bronze solder with a high melting temperature. We created a unique product machine system with a high vacuum furnace and a bronze solder that contains a metallic compound. The diamond cutting mechanism employed in this study is based on the mild wear phenomenon, owing to the friction between the diamond surfaces. A linear relationship between the cutting length and wire feed distance was observed. The relationship can be approximated as y = 0.3622x, where y (μm) is the cutting depth and x (km) is the wire feed distance. The life of the saw-wire was longer than that of the 6000 km wire feed distance and was tested by reciprocating an 8-m short wire at a speed, tension, and cutting force of 150 m/min, 1 N, and 0.2 N, respectively. A single crystal diamond substrate could be cut along the designed line, which was more than 2 mm long. The cutting speed was maintained constant at 0.36 μm/km. |
| Starting Page | 5524 |
| e-ISSN | 19961944 |
| DOI | 10.3390/ma15165524 |
| Journal | Materials |
| Issue Number | 16 |
| Volume Number | 15 |
| Language | English |
| Publisher | MDPI |
| Publisher Date | 2022-08-11 |
| Access Restriction | Open |
| Subject Keyword | Materials Manufacturing Engineering Diamond Cutting Diamond Saw Wire Fixed Grain Saw Wire Diamond Grain Cutting Length |
| Content Type | Text |
| Resource Type | Article |
