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Interfacial Bonding Improvement through Nickel Decoration on Carbon Nanotubes in Carbon Nanotubes/Cu Composite Foams Reinforced Copper Matrix Composites
| Content Provider | MDPI |
|---|---|
| Author | Wang, Dan Yan, An Liu, Yichun Wu, Zhong Gan, Xueping Li, Fengxian Tao, Jingmei Li, Caiju Yi, Jianhong |
| Copyright Year | 2022 |
| Description | Inhomogeneous structures with carbon nanotubes (CNTs), reinforced with Cu composite foams as the reinforcing skeletons (CNTs/Cu_{f}$^{®}$Cu), have been designed to overcome the paradox between strength and ductility or conductivity in copper matrix composites. The interface between CNTs and the copper matrix is usually weak, due to poor wettability and interaction. In this study, nickel nanoparticles are decorated onto CNTs to improve interfacial bonding. The broader interface transition area between CNTs and copper with $Ni_{3}$C interfacial products formed, and a combination of improved electrical conductivity (95.6% IACS), tensile strength (364.9 MPa), and elongation (40.6%) was achieved for the Ni-decorated CNTs/Cu_{f}$^{®}$Cu (Ni-CNTs/Cu_{f}$^{®}$Cu). In addition, the strengthening mechanisms are discussed in this study. |
| Starting Page | 2548 |
| e-ISSN | 20794991 |
| DOI | 10.3390/nano12152548 |
| Journal | Nanomaterials |
| Issue Number | 15 |
| Volume Number | 12 |
| Language | English |
| Publisher | MDPI |
| Publisher Date | 2022-07-25 |
| Access Restriction | Open |
| Subject Keyword | Nanomaterials Environmental Engineering Carbon Nanotubes Copper Matrix Composite Three-dimensional Reinforcement Interface Modification Electrical Properties Mechanical Properties |
| Content Type | Text |
| Resource Type | Article |
