NDLI: Enhanced Thermal Conductivity of Epoxy Composites Filled with $Al_{2}O_{3}$/Boron Nitride Hybrids for Underfill Encapsulation Materials

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Enhanced Thermal Conductivity of Epoxy Composites Filled with $Al_{2}O_{3}$/Boron Nitride Hybrids for Underfill Encapsulation Materials

Content Provider	MDPI
Author	Sanchez, William Anderson Lee Huang, Chen-Yang Chen, Jian-Xun Soong, Yu-Chian Chan, Ying-Nan Chiou, Kuo-Chan Lee, Tzong-Ming Cheng, Chih-Chia Chiu, Chih-Wei
Copyright Year	2021
Description	In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.
Starting Page	147
e-ISSN	20734360
DOI	10.3390/polym13010147
Journal	Polymers
Issue Number	1
Volume Number	13
Language	English
Publisher	MDPI
Publisher Date	2021-01-01
Access Restriction	Open
Subject Keyword	Polymers Coatings and Films Underfill Encapsulation Aluminum Oxide Boron Nitride Hybrid Filler Thermal Conductivity Coefficient of Thermal Expansion
Content Type	Text
Resource Type	Article

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