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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zimmermann, L. Schnarrenberger, M. Mitze, T. Bruns, J. Petermann, K. |
| Copyright Year | 2005 |
| Description | Author affiliation: Institut fur Hochfrequenz-und Halbleiter-Systemtechnologien, Technische Univ. Berlin, Germany (Zimmermann, L.; Schnarrenberger, M.; Mitze, T.; Bruns, J.; Petermann, K.) |
| Abstract | In our study we compare the quality of dry etched rip waveguide facets to facets prepared by a conventional polishing technique. Linear SOI waveguide arrays were fabricated on BESOI (bonded and etched-back SOI) material with a silicon top-layer of H = 4 /spl mu/m. We used standard contact lithography for patterning and a commercial RIE system for waveguide and facet etching. We studied different process flows (facet-first and rip-first), different masking materials and loading effects on the wafer. The surface of the facets was characterized by high resolution scanning electron microscopy (SEM). The additional coupling loss introduced by the process flow and by the etching conditions as well as the impact of the two on uniformity of the waveguide transmission were quantified by means of fiber-to-fiber optical measurements (at 1.55 /spl mu/m). |
| Starting Page | 260 |
| Ending Page | 264 |
| File Size | 1251909 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780389492 |
| DOI | 10.1109/WFOPC.2005.1462136 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-06-22 |
| Publisher Place | Italy |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wafer bonding Optical fiber losses Scanning electron microscopy Dry etching Lithography Propagation losses Silicon Optical coupling Optical waveguides Optical surface waves |
| Content Type | Text |
| Resource Type | Article |
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