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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Pham, A.T. Sorée, B. Magnus, W. Jungemann, C. Meinerzhagen, B. Pourtois, G. |
| Copyright Year | 2011 |
| Description | Author affiliation: EIT4, Universita¨t der Bundeswehr Mu¨nchen, 85577 Neubiberg, Germany (Jungemann, C.) || Physics modelling and simulation, IMEC, 3001 Leuven, Belgium (Pham, A.T.; Sorée, B.; Magnus, W.; Pourtois, G.) || BST, TU Braunschweig, 38023 Braunschweig, Germany (Meinerzhagen, B.) |
| Abstract | Junctionless nanowire pinch-off FETs [1–3] are promising device structures for beyond CMOS technologies. The device is called ”junctionless” [3] because it contains a uniform doping level $(n^{+}$ $n^{+}$ $n^{+}$ for nFETs or $p^{+}$ $p^{+}$ $p^{+}$ for pFETs) within the whole device including source, drain, and channel, which is different from the non-uniform $n^{+}$ $pn^{+}$ (or $p^{+}$ $np^{+})$ doping profiles in conventional nMOSFETs (or pMOSFETs). Therefore, during the fabrication the doping profile in junctionless nanowire pinch-off FETs is easier to control than in the conventional MOSFET case, especially for sub-100 nm gate length devices [3]. In additions, junctionless pinch-off FETs operate similar to JFETs and inversion is not required. In order to turn off the device, a sufficiently large |VGS| is required to extend the depletion region until pinch-off occurs. This is the reason for the name ”pinch-off” FET. If the horizontal cross-section area of the nanowire is scaled, the doping level must be increased in order to keep the threshold voltage unchanged [1]. Due to the high doping levels (typically $10^{18}$ $cm^{−3}$ to 5 × $10^{19}$ $cm^{−3})$ the carriers are strongly influenced by ionized impurity scattering, and as a consequence, the channel effective mobility is low. Therefore, it is important to include stress/strain engineering in combination with non-standard crystallographic channel orientations to boost the transport performance of the junctionless nanowire pinch-off FET. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 138435 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781457700903 |
| e-ISBN | 9781457700910 |
| e-ISBN | 9781457700897 |
| DOI | 10.1109/ULIS.2011.5757989 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-03-14 |
| Publisher Place | Ireland |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Doping Logic gates Capacitance Silicon Stress FETs Strain |
| Content Type | Text |
| Resource Type | Article |
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