NDLI: Surface-enhanced copper bonding wire for LSI and its bond reliability under humid environment

Content Provider	IEEE Xplore Digital Library
Author	Uno, T. Kimura, K. Yamada, T.
Copyright Year	2009
Description	Author affiliation: Nippon Micrometal Corporation, 158-1, Sayamagahara, Iruma-city, Saitama, 358-0032, JAPAN (Yamada, T.) \|\| Advanced Materials & Technical Research Laboratories, Nippon Steel Corporation, 293-8511, JAPAN (Uno, T.; Kimura, K.)
Abstract	There is growing interest in Cu wire bonding for LSI interconnection due to cost savings and better electrical and mechanical properties. Cu bonding wires, in general, are severely limited in their use compared to Au wires; such as wire oxidation, lower bondability, forming gas of N2+5%H2, and lower reliability. It is difficult for conventional bare Cu wires to achieve the target of LSI application. A surface-enhanced Cu wire (EX1) has been developed. It is a Pd-coated Cu wire and has many advantages compared to bare Cu wires. Stitch strength was much better under fresh conditions and maintained without any deterioration after being stored in air for a prolonged period of time. EX1 had a lifetime of over 90 days in air, although it was 7days for the bare Cu wire. Spherical balls were formed with pure N2 (hydrogen-free), whereas the bare Cu produced offcenter balls. Cost-effective and secure gas, pure N2 was only available for EX1. The reliability for Cu wire bonding under humid environment was investigated in pressure cooker test (PCT). The lifetime for EX1 and the bare Cu was over 800h and 250h, respectively. Humidity reliability was significantly greater for EX1. Continuous cracking was formed at the bond interface for the bare Cu wire. Corrosion-induced deterioration would be the root cause of failure for bare Cu wires in PCT. EX1 improves the bond reliability by controlling diffusion at the bond interface. The excellent performance of Pd-coated Cu wire, EX1 is comparable with Au wires and suitable for LSI packaging.
Starting Page	1
Ending Page	10
File Size	1042747
Page Count	10
File Format	PDF
ISBN	9781424447220
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-06-15
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	IMAPS-Italy
Subject Keyword	PCT Gold Costs Copper bonding wire Large scale integration Mechanical factors Maintenance Wire Diffusion bonding ball formation humidity reliability Oxidation Copper stitch bond Testing
Content Type	Text
Resource Type	Article

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