NDLI: MPS-C2 and Post Encapsulation Grinding technology for ultra fine pitch and thin die flip chip applications

Content Provider	IEEE Xplore Digital Library
Author	Orii, Y. Toriyama, K. Oyama, Y. Nishio, T.
Copyright Year	2008
Description	Author affiliation: Packaging Technol. Solution Dev., Kyoto (Orii, Y.; Toriyama, K.; Oyama, Y.) \|\| Delivery Project Office, Kyoto (Nishio, T.)
Abstract	Flip chip technology is now being introduced in PoP(Package on Package) packages for the digital consumer electronics such as digital still cameras and mobile phones. PoP reduces the component height and improves the electrical performance. A MPS-C2(Metal Post Solder Chip Connection) method was developed for ultrafine pitch flip chip interconnections in mobile applications. A bare die with Sn/Ag-solder-capped Cu post bumps is directly connected on an organic substrate by using a reflow process without flux cleaning. This technology supports the SMT/Flip Chip-hybrid assembly required for SoP (System on Package) manufacturing, and it is the least expensive method among current ultrafine pitch flip chip interconnetion methods. We ran reliability tests with 50-um-pitch MPS-C2 interconnections. In addition to fine pitch interconnections, each die must be less than 70 um thick to insure that the final stack will be thin enough. Such thin die were not unsuitable for the original MPS-C2 process, because the dies tended to move during the reflow process. We developed a Post Encapsulation Grinding (PEG) method to resolve this problem. In this method the die is ground down to be less than 70 um thick after joining and underfilling.
Starting Page	95
Ending Page	98
File Size	2009169
Page Count	4
File Format	PDF
ISBN	9781424434985
DOI	10.1109/VPWJ.2008.4762218
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-12-01
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Encapsulation Assembly systems Surface-mount technology Tin Digital cameras Mobile handsets Cleaning Flip chip Consumer electronics Electronics packaging
Content Type	Text
Resource Type	Article

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