NDLI: Research on thermal characteristics and on-chip temperature-controlling for silicon micro-gyroscope

Content Provider	IEEE Xplore Digital Library
Author	Lu Xu Bo Yang Shourong Wang Hongsheng Li Libin Huang
Copyright Year	2011
Description	Author affiliation: Key Laboratory of Micro Inertial Instrument and Advanced Navigation Technology of Ministry of Education, Southeast University, Nanjing 210096, China (Lu Xu; Bo Yang; Shourong Wang; Hongsheng Li; Libin Huang)
Abstract	This paper presents a novel gyroscope prototype with on-chip heater and temperature sensor to keep gyroscope uninfluenced by environmental temperature. It firstly introduced the gyroscope's working principle and deduced its temperature dependence to get performances' temperature sensitivity. It turns out capacitive sensitivity has a variation of 13.5 % when gyroscope's working temperature has a change of 50K. Then the gyroscope prototype with on-chip temperature-controlling was given and its performances were analyzed theoretically and numerically. Besides, fabrication process was designed based on Silicon-On-Glass (SOG) technology. Simulation results indicate that, to keep gyroscope's temperature at 60°C with a temperature difference between center mass and anchor below 1.6°C, the power consumption increases from 0.011W to 0.213W when environmental temperature decreases from 55°C to −40°C. When environmental temperature is 20°C and consumption power is 0.0884W, gyroscope can reach its equilibrium state of 60°C from 20°C within 20s. Stress intensities inside gyroscope are less than the ultimate tensile or compressive strength of each material. It theoretically proves that the prototype meets the three demands of low power consumption, even temperature distribution and quick thermal response. Hopefully, the prototype can be manufactured and tested in the future.
Starting Page	807
Ending Page	812
File Size	1130202
Page Count	6
File Format	PDF
ISBN	9781457702686
e-ISBN	9781457702709
e-ISBN	9781457702693
DOI	10.1109/ICINFA.2011.5949105
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-06-06
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature sensors Temperature dependence Temperature Sensitivity silicon micro-gyroscope Silicon-On-Glass Glass ANSYS Silicon Gyroscopes sensitivity on-chip temperature-controlling
Content Type	Text
Resource Type	Article

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