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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Benazzi, A. Brunet, M. Dubreuil, P. Mauran, N. Bary, L. Laur, J.-P. Sanchez, J.-L. Isoird, K. |
| Copyright Year | 2007 |
| Description | Author affiliation: Univ. of Toulouse, Toulouse (Benazzi, A.; Brunet, M.; Dubreuil, P.; Mauran, N.; Bary, L.; Laur, J.-P.; Sanchez, J.-L.; Isoird, K.) |
| Abstract | The integration of passive components on silicon for future DC-DC converters applications is still a challenging area of research. This paper focuses on integrated 3D capacitors with high capacitance density fabricated with microfabrication techniques on silicon and in particular DRIE. The fabricated prototypes were characterised: a capacitance density between 29 and 46 $nF/mm^{2}$ was demonstrated up to 800 kHz. An improvement is presented on the equivalent series resistance (ESR), which impedes currently on the component utilisation at higher frequencies. |
| Starting Page | 1 |
| Ending Page | 9 |
| File Size | 337809 |
| Page Count | 9 |
| File Format | |
| ISBN | 9789275815108 |
| DOI | 10.1109/EPE.2007.4417614 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-09-02 |
| Publisher Place | Denmark |
| Access Restriction | Subscribed |
| Rights Holder | EPE Association |
| Subject Keyword | Deep Reactive Ion Etching Paramagnetic resonance Passive filters trench Capacitors DC-DC power converter DC-DC power converters Etching Schottky contact phosphorus diffusion Prototypes Capacitance Frequency Silicon Impedance integrated capacitor |
| Content Type | Text |
| Resource Type | Article |
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