NDLI: Transmission line impedance design for usb2.0 high-speed signals of smartphone accessories

Content Provider	IEEE Xplore Digital Library
Author	Tae-Seon Kim Soo-Won Kim
Copyright Year	2012
Description	Author affiliation: Department of Electrical Engineering, Korea University, Seoul, South Korea (Tae-Seon Kim; Soo-Won Kim)
Abstract	This paper presents a method of improving the signal integrity of the universal serial bus (USB) by analyzing transmission line impedance. There are many accessories for smartphones in the marketplace due to the recent fast proliferation of smartphones. Some of these accessories have data sync functions to connect smartphones with host-like computers. Currently, most smartphones comply with USB2.0 high-speed (HS) specification for the data sync. Signals for USB2.0 HS in smartphones are extremely vulnerable to mismatched impedance when adding peripheral electronic parts such as switches, capacitors, transmission lines, etc. However, because the accessories supporting data sync are made of printed circuit boards (PCB), flexible printed circuit boards (FPCB), or both, if the transmission line impedance is designed carelessly, USB communication will not operate. This paper presents a transmission line impedance design for USB2.0 HS signals in Power Pack that is a portable charging device accessory for the Samsung Galaxy S. This device was assembled using connected PCB and FPCB because of its sleek design and hence was more vulnerable to impedance mismatch. This paper simulated PCB signal integrity and impedance design with Si8000, developed by Polar Instruments, and was verified with USB-HS eye-diagrams in the time domain.
Starting Page	122
Ending Page	126
File Size	1255111
Page Count	5
File Format	PDF
ISBN	9781467311564
e-ISBN	9781467311571
e-ISBN	9781467311557
DOI	10.1109/ISCIT.2012.6380874
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-10-02
Publisher Place	Australia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	smartphone Materials Jitter USB-HS FPCB Synchronization PCB Integrated circuits Connectors Universal Serial Bus Eye-diagrams Impedance portable charging application accessory Signal integrity
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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