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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Catelani, M. Scarano, V.L. |
| Copyright Year | 2011 |
| Description | Author affiliation: University of Florence, Department of Electronics and Telecommunications, via S. Marta 3, 50139, Firenze, Italy (Catelani, M.; Scarano, V.L.) |
| Abstract | Electronic equipment industries are interested in evaluation of the life of new soldering lead-free materials used for the implementation of electrical interconnections and consequently in new soldering process. In fact, they have to guarantee RoHS conformity assessment of the electrical and electronic devices, in terms of restriction of the use of hazardous substances with the aim to protect human health and environment. Materials such as lead-free alloys are RoHS compliant but the consumer requires evidence that such solders are equally reliable as tin-lead solders, for the proposed use and lifetime of the product. In order to support new International Standards and fill the technology knowledge gap, the paper proposes a new multi-stress accelerated life model able to evaluate the life of tin-silver-copper alloy under combined and sequential tests: cycling climatic and random vibration tests. |
| Starting Page | 420 |
| Ending Page | 425 |
| File Size | 143209 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424493012 |
| e-ISBN | 9781424493036 |
| e-ISBN | 9781424493029 |
| DOI | 10.1109/DEMPED.2011.6063657 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-09-05 |
| Publisher Place | Italy |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Vibrations tin-silver-copper alloy Life estimation cycling climatic test Lead solderings random vibration test Reliability Soldering lead-free Stress accelerated life test |
| Content Type | Text |
| Resource Type | Article |
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