NDLI: 5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED

Content Provider	IEEE Xplore Digital Library
Author	Vairavan, R. Sauli, Z. Retnasamy, V. Ehkan, P. Ong Tee Say
Copyright Year	2013
Description	Author affiliation: Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia (Vairavan, R.; Sauli, Z.; Retnasamy, V.; Ong Tee Say) \|\| Sch. of Comput. & Commun. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia (Ehkan, P.)
Abstract	Light-emitting diodes (LEDs), have materialized as an innovative light source which features energy saving properties, good optical performance and efficacy which is added advantage over orthodox lighting systems. However, the efficacy of the LED is influenced by heat generated at the junction of the LED. Hence, in this study, the thermal and stress analysis of single chip LED package with copper diamond heat slug with dimension of 5mm x 5mm x 1mm was carried out through simulation under natural convection condition. Input power of 0.1W and 1W were applied to the single chip LED model. Result of the simulation indicates that at input power 1W, junction temperature of 107.02 °C and stress of 104.59 MPa were obtained.
Starting Page	78
Ending Page	81
File Size	273334
Page Count	4
File Format	PDF
ISBN	9780769551012
DOI	10.1109/AMS.2013.17
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-07-23
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Analytical models Heating Light emitting diodes junction temperature ansys Thermal analysis single chip LED copper diamond slug Junctions Heat sinks Stress thermal analysis
Content Type	Text
Resource Type	Article

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