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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Fitzgibbon, M. McSwiney, D. O'Keeffe, D. Mondal, J. Redmond, D. Waldie, W. |
| Copyright Year | 2005 |
| Description | Author affiliation: Freescale Semicond., Cork, Ireland (Fitzgibbon, M.; McSwiney, D.; O'Keeffe, D.) |
| Abstract | This paper describes a multi component mixed process "system-in-a-package" (SIP) transceiver suitable for wireless quad band EGPRS applications. The unique approach of pursuing this SIP enables faster time to market, mitigates risk and reduces customer's development cycle time. This solution offers antennae-to-bits functionality using less than 250mm/sup 2/ of valuable board space. The Tx and Rx performance results are shown and the technology developed to implement the transceiver solution is described. The module integrates three ICs; 0.18 /spl mu/m RF-CMOS for RF/analog, 0.13 /spl mu/m CMOS for mixed signal analog/digital/DSP and GaAs for integrated passive devices (IPD). It contains a quad band balun plus surface mount devices (SMD) for loop filter and RF bypass. It has the complete transmit line up from digital bits (as per DigRF standard) to power amplifier interface, as well as receive function from LNA inputs to bits (per DigRF standard). |
| File Size | 398029 |
| File Format | |
| ISBN | 0780390660 |
| DOI | 10.1109/ECCTD.2005.1522955 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-09-02 |
| Publisher Place | Ireland |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | GSM Radio frequency Ground penetrating radar Space technology RF signals Time to market Digital signal processing Packaging CMOS technology Transceivers |
| Content Type | Text |
| Resource Type | Article |
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