NDLI: Phase change heat dissipater of aluminium container

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2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

20th International Workshop on Thermal Investigations of ICs and Systems

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

18th International Workshop on THERMal INvestigation of ICs and Systems

2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2010 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2009 15th International Workshop on Thermal Investigations of ICs and Systems

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems

Collection of papers presented at the 14th International Workshop on THERMal INvestigation of ICs and Systems

Workshop Committee and Programme Committee

Table of contents

CFD for Electronics Cooling: MCAD and EDA embedded vs. stand-alone

Triangulation method for structure functions of multi-directional heat-flows

Transient dual interface measurement of the Rth-JC of power packages

Evaluation of short pulse thermal transient measurements

New approach for thermal investigation of a III – V power transistor

Ensuring temperature-insensitivity of dual-Vt designs through ITD-aware synthesis

Managing leakage power and reliability in hot chips using system floorplanning and SRAM design

Assessment of die attach quality by analysis of circuit thermal response spectrum

Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography

Compact thermal networks for conjugate heat transfer by moment matching

Block-level thermal model for floorplan stage in VLSI design flow

Multiscale 3D thermal analysis of analog ICs: From full-chip to device level

The minimal set of parameters for exact dynamic thermal models

Automatic electro-thermal analysis in Mentor Graphics PCB Design System

Integrated thermal modeling of heterogeneous eCubes stacked devices

logical effort model extension with temperature and voltage variations

A novel procedure and device to allow comprehensive characterization of power leds over a wide range of temperature

Multi-physics analysis of a photovoltaic panel with a heat recovery system

Phase change heat dissipater of aluminium container

Thermal design of fully-isolated bipolar transistors

Thermal transient characterisation of complex circuits

In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features

Compact thermal modeling of Electric Double-Layer-Capacitors

Hot-carrier effects on power RF LDMOS device reliability

Thermal characterization and modelling of lithium-based batteries at low ambient temperature

Design of a static TIM tester

Multithreading and Strassen’s algorithms in SUNRED field solver

The semiconductor - dielectric interface from PN junction periphery and its influence on reliability of power devices at high temperature

FPGA power model for minimizing the thermal dissipation

Thermal conductivity in nanostructures: the role of acoustic phonons

NANOPACK - Nano packaging technology for interconnect and heat dissipation

Recent progress of thermal interface material research - an overview

Band gaps in a phononic crystal made of a periodical array of dots on a plate

Extended summary: Nanoscale management of electron-phonon energy transfer

Silicon integrated vapor chamber equipped with integrated sensor network for in-situ thermal monitoring and cooling optimization

Micro-channel heat sink optimization

Laser scanning thermomechanical imaging of microelectronic devices

Dual approach for HBT thermal impedance

Ultra-high temperature (≫ 300°C) suspended thermodiode in SOI CMOS technology

Possibilities of humidity sensing with thermal transient testing on porous structures

Evaluation of an electrical method for detection of die attach imperfections in Smart Power Switches using transient thermal FEM simulations

On the standardisation of thermal characterisation of LEDs Part I: Comparison with IC packages and proposal for action

On the standardisation of thermal characterisation of LEDs Part II: Problem definition and potential solutions

Practical chip-centric electro-thermal simulations

Electro-thermal analysis of Electric Double-Layer-Capacitors

Consideration of thermal effects in logic simulation

Electro-thermal investigation of OLEDs

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

Phase change heat dissipater of aluminium container

Content Provider	IEEE Xplore Digital Library
Author	Esarte, J. Wolluschek, C. Armendariz, E.
Copyright Year	2008
Description	Author affiliation: Poligono Mocholi-Plz. Cein, CEMITEC, Noain (Esarte, J.; Wolluschek, C.; Armendariz, E.)
Abstract	Due to the cupperpsilas increasing cost there is a trend to use more and more the aluminium instead of cupper. When using aluminium in phase change dissipaters there are two aspects that must be consider: one is the welding difficulty and other is the surface cleaning for a better wetting. It is very well known how much the solid surface quality affects on the liquidpsilas wetting capacity. At this point little is done on the aluminium cleaning process in order to improve the liquid wetting without damaging the material itself, thatpsilas to say, corrosion appearance.
Starting Page	97
Ending Page	100
File Size	870678
Page Count	4
File Format	PDF
ISBN	9781424433650
DOI	10.1109/THERMINIC.2008.4669887
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-09-24
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	EDA Publishing Association / THERMINIC2008
Subject Keyword	Surface cleaning Phase change materials Industrial electronics Costs Temperature Welding Corrosion Aluminum Prototypes Containers
Content Type	Text
Resource Type	Article

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