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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hsien-Chie Cheng Chieh-Sheng Lin Wen-Hwa Chen Yung-Yue Hsu Ruoh-Huey Uang |
| Copyright Year | 2006 |
| Description | Author affiliation: Dept. of Aerosp. & Syst. Eng., Feng Chia Univ., Taichung (Hsien-Chie Cheng) |
| Abstract | The process-induced thermal-mechanical behaviors of the np ACF typed FC technology during bonding process and temperature variation are investigated. For achieving the goal, a process-dependent simulation methodology is introduced, which incorporates a transient thermal and static thermal-mechanical finite element (FE) modeling and a "death-birth" meshing scheme. Prior to the modeling, the mechanical properties of the $^{np}ACF$ film are first characterized through both the rule-of-mixture technique and the proposed FE-based scheme. Moreover, the validity of the proposed transient thermal modeling is also verified by way of a micro thermocouple technique for temperature measurement. Finally, parametric FE study is performed to assess the dependence of the thermal-mechanical behaviors of the substrate and the contact stress at the I/O interconnects and the peeling stress at the nonconductive paste (NCP) on a number of geometry and material design parameters |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 4297516 |
| Page Count | 4 |
| File Format | |
| ISBN | 1424407346 |
| DOI | 10.1109/IMPACT.2006.312214 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-10-18 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Parametric FE Study Bonding processes Mechanical factors Finite element methods Micro Thermocouple Substrates Temperature measurement Geometry Nanowire/polymer-based Anisotropic Conductive Film Anisotropic conductive films Thermal conductivity Rule-of-mixture Technique Flip Chip Technology Finite Element Modeling Assembly Thermal stresses |
| Content Type | Text |
| Resource Type | Article |
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