NDLI: Comparison of thermal enhancements to a commercial quad flatpack

Content Provider	IEEE Xplore Digital Library
Author	Wyland, C.P.
Copyright Year	1992
Description	Author affiliation: Integrated Device Techol. Inc., Santa Clara, CA, USA (Wyland, C.P.)
Abstract	The thermal characteristics of three 160 pin commercial quad flatpacks were examined. The packages were modeled and tested in accordance with MIL STD 883C-Method 1012.1 and SEMI Standards G38-87, G42-88, G43-87. The purpose of the comparison was to find the coolest commercial class package currently available for high-power RISC devices. The author addresses the relation of theta jc as a poor predictor of theta ja for the thermal enhancements presented and introduces a possible heuristic for modeling semiconductor component packaging. Use of the heuristic is shown to be generally accurate within 5% of the measured values using the data presented. The all-aluminum quad flatpack appears to have the best thermal characteristics of the packages compared. Although it has a theta jc comparable to that of the thermally enhanced plastic quad flatpack, it has better theta ja numbers from still air to high-speed air flow. For low-power applications the normal plastic quad flatpack seems to be an acceptable package, but when the power dissipation exceeds 2 W or more, the thermally enhanced packages must be used.
Starting Page	257
Ending Page	261
File Size	294725
Page Count	5
File Format	PDF
ISBN	0780305035
DOI	10.1109/ITHERM.1992.187771
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1992-02-05
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Semiconductor device packaging Copper Temperature sensors Electrical resistance measurement Reduced instruction set computing Printed circuits Plastic packaging Aluminum Thermal resistance
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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