NDLI: Evaluation of die-attach adhesives by curvature measurements

Content Provider	IEEE Xplore Digital Library
Author	Lu, G.-Q. Kromann, G.B. Mogilevsky, B. Gupta, T.K.
Copyright Year	1992
Description	Author affiliation: Alcoa Electronic Packaging Inc., Alcoa Center, PA, USA (Lu, G.-Q.; Kromann, G.B.; Mogilevsky, B.; Gupta, T.K.)
Abstract	The authors examined three types of die-attach adhesives by measuring curvatures in assemblies that are formed by adhesively joining silicon chips to alumina substrates. The adhesives differ mainly in their post-cure elastic moduli, which are 24 GPa for a solder-like adhesive, 2.7 GPa for an epoxy-like adhesive, and 0.003 GPa for a gel-like adhesive. All of the as-prepared assemblies have residual bending resulting from the adhesive curing process. The assembly bonded by the gel-like adhesive has substantially lower, about a factor of ten less, bending than the assemblies attached by the other two types of adhesives. Thermal responses of assembly curvatures are measured by subjecting the assemblies to a temperature excursion from -15 degrees C to 160 degrees C. The measured temperature dependences of curvature in all three types of assemblies are found to be in good agreement with the theoretical derivations by E. Suhir (1986) for thermally induced bending in finite tri-material structures.
Starting Page	155
Ending Page	158
File Size	274578
Page Count	4
File Format	PDF
ISBN	0780305035
DOI	10.1109/ITHERM.1992.187755
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1992-02-05
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Silicon Semiconductor device measurement Temperature measurement Thermal stresses Optical sensors Thickness measurement Temperature distribution Substrates Curing
Content Type	Text
Resource Type	Article

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