NDLI: A dynamic model for predicting the motion of solder droplets during assembly

Content Provider	IEEE Xplore Digital Library
Author	Kulkarni, D. Subbarayan, G.
Copyright Year	2000
Description	Author affiliation: Colorado Univ., Boulder, CO, USA (Kulkarni, D.)
Abstract	The dynamic motion of a solder droplet during assembly is a complex, unsteady, free surface problem involving surface tension and viscous effects. The motion of the droplet is coupled with the motion of the component or chip to be assembled and involves dynamic contact lines. A methodology based on a Non-Uniform Rational B-Spline (NURBS) discretization has been developed for the dynamic analysis of the droplet motion. A surface energy based formulation has been developed to incorporate the surface tension effects. The developed methodology leads to an updated Lagrangian scheme with a Galerkin in space and least square in time formulation. The Non-Uniform Rational B-Spline (NURBS) representation used, for the spatial discretization enables the method to handle problems involving complex droplet geometries. The ability of the NURBS representation to provide both global and local control, along with the least square method used in this methodology, enables us to develop an unconditionally stable time integration scheme which can be optimized to achieve desired accuracy and numerical dissipation efficiently. A sample problem of droplet shape evolution has been solved to demonstrate the path prediction capability of the proposed methodology. In future, the method can be applied to solve various real world dynamic motion problems associated with droplets.
Starting Page	368
Ending Page	376
File Size	737220
Page Count	9
File Format	PDF
ISBN	0780359127
ISSN	10899870
DOI	10.1109/ITHERM.2000.866849
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Predictive models Spline Surface topography Surface reconstruction Assembly Surface tension Least squares methods Motion analysis Lead Lagrangian functions
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in