NDLI: Intelligent Fill Pattern and Extraction Methodology for SoC

Content Provider	IEEE Xplore Digital Library
Author	Balasinski, A. Cetin, J.
Copyright Year	2006
Description	Author affiliation: Cypress Semicond., San Diego, CA (Balasinski, A.; Cetin, J.)
Abstract	Uniform pattern density of physical layers of the die, such as diffusion, poly, or metals, has significant impact on electrical parameters of the product. At active level, variations in pattern density across the die translate into wide distributions of punch-through or breakdown voltages. At poly and metal levels, a non-uniform pattern density would result in poor planarity and give rise to high via resistances and poor control of the inter-layer capacitive coupling. However, at design stage, the complex functions of SoC functional blocks do not give designers enough freedom to strictly observe a predefined set of pattern density rules. Instead, the die pattern has to be made more uniform at die integration level, by global addition of fill features (waffles). While conceptually simple, this presents significant technical challenge, as the criteria for this addition are often difficult to meet. The simple but time consuming way of making pattern density uniform is based on manual drawing of dummy features over the electrical database (intellectual property, IP) of the die. A simplistic, automated approach is to add fill pattern of fixed density until it becomes close to target pattern density of the die. However, it may not be possible to equalize out all the regions even with changes in the die architecture. In addition, this approach tends to add dummy features even if unnecessary, driving towards very high pattern density. This solution is disadvantageous for RF/analog products the performance of which can be compromised by the capacitive coupling through the waffles. The methodology proposed that the initial die pattern density is first evaluated followed by the adjustable, intelligent fill of dynamic density at the block level. This way, it is possible to keep the original pattern density and work only on the areas of small density. The authors propose that the standard cell methodology should enable pre-die level modifications of pattern density and its extraction, to ensure that all the required blocks could be placed on the product and that their parasitics are properly extracted
Sponsorship	Univ. of Calgary Ain Shams Univ. Mentor Graphics Tech. Inst. on Micro, Nano and Smart Syst
Starting Page	156
Ending Page	159
File Size	1669952
Page Count	4
File Format	PDF
ISBN	1424408989
DOI	10.1109/IWSOC.2006.348227
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-27
Publisher Place	Egypt
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Physical layer Radio frequency Contact resistance Isolation technology Conferences System-on-a-chip Real time systems Intellectual property Etching Planarization
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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