NDLI: A low-cost validation setup for the thermal modelling of electronic devices

Content Provider	IEEE Xplore Digital Library
Author	Pinciroli, C. Riahi, S. Beltrame, G.
Copyright Year	2015
Description	Author affiliation: Dept. of Comput. Eng., Ecole Polytech. de Montreal, Montreal, QC, Canada (Pinciroli, C.; Riahi, S.; Beltrame, G.)
Abstract	Modern integrated circuits generate very high heat fluxes that can lead to a high temperature, degrading the performance and reducing the life time of the device. Thermal simulation is used to prevent this kind of issues, and many models were introduced in recent years. However, their validation is challenging: it is either based on established simulators (with reduced accuracy), or requires to produce a specific test chip with several thermal sensors. In this paper we propose a methodology and measurement setup that uses existing commercial processors to validate thermal models. We use infrared thermography and low-cost thermoelectric cooling, avoiding the issues of mineral oil setups used in previous works. We show how our approach was used to validate two thermal simulators.
Starting Page	1
Ending Page	4
File Size	456156
Page Count	4
File Format	PDF
ISBN	9781479988938
DOI	10.1109/NEWCAS.2015.7182084
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-06-07
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature measurement Program processors Cameras Temperature distribution Integrated circuit modeling Heating Cooling
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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