NDLI: Effects of aeronautical conditions on passivation cracking of micro-structures of IC packages

Content Provider	IEEE Xplore Digital Library
Author	He, Y.T. Li, H.P. Li, F. Wang, L. Zhang, G.Q. Ernst, L.J.
Copyright Year	2006
Description	Author affiliation: Coll. of Aeronaut., Air Force Eng. Univ., Xi'an (He, Y.T.; Li, H.P.; Li, F.)
Abstract	Passivation cracking is one of the main failures of ICs and thermo-mechanical failures are the root cause. A major cause for these failures is due to the different coefficients of thermal expansion (CTE), different Young's modulus, Poisson's ratios of package materials under different temperatures and some mechanical loadings. Therefore the working conditions of compound materials used here is expected to have a pronounced influence on the local stress distribution in the passivation layer. The aeronautical conditions mainly include different temperatures and overloads as well as the vibration conditions. Here the finite element simulations and the maximum principal stress theory are applied to investigate the effects of aeronautical conditions on passivation cracking of microstructures of IC packages, and the result paves the way for compound materials selection in IC packages and usage under aeronautical conditions
Starting Page	1
Ending Page	4
File Size	140148
Page Count	4
File Format	PDF
ISBN	1424402751
DOI	10.1109/ESIME.2006.1644000
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-04-24
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Passivation Integrated circuit packaging Temperature Thermomechanical processes Thermal expansion Thermal loading Employee welfare Thermal stresses Vibrations Finite element methods
Content Type	Text
Resource Type	Article

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