NDLI: A convenient wafer level bonding based on unpatterned BCB

Content Provider	IEEE Xplore Digital Library
Author	Lei Li Kangfa Deng Wen Xia Ningli Zhu Song Li Weiguo Su Wei Zhang
Copyright Year	2014
Description	Author affiliation: Nat. Key Lab. of Micro/Nano Fabrication Technol., Peking Univ., Beijing, China (Lei Li; Kangfa Deng; Wen Xia; Ningli Zhu; Song Li; Weiguo Su; Wei Zhang)
Abstract	In this paper, a convenient wafer level bonding based on un-patterned BCB to achieve all-silicon structures was presented. This method is easy to operate, and can be applied in the multi-wafer bonding. After the BCB was spin-coated on the substrate wafer and soft-baked, no process had been carried out on it. Both the time node of pressure applied to the bonding and the BCB soft-bake process had been explored before bonding two wafers. After bonding, the obtained results indicated that the BCB transverse deformation of this BCB bonding was less than 36μm at the optimal soft-bake temperature of 170 C with the soft-bake time of 40min. Also, the bonding strength of the BCB bonding was tested by DAGE 4000, and the results were 15~17MPa, which is suitable for the needs of the wafer level bonding.
Starting Page	502
Ending Page	506
File Size	819877
Page Count	5
File Format	PDF
ISBN	9781479947263
DOI	10.1109/NEMS.2014.6908859
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-04-13
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Silicon Surface treatment Substrates Glass transverse deformation wafer level bonding BCB soft bake
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Glass wafer mechanical properties: A comparison to silicon

Adhesive wafer bonding of GaAs/Glass with Benzocyclobutene and dry film for GaAs CCD

A New BCB Film Zero-Level Packaging for RF Devices

Solar cells by Germanium layer transfer on glass

Fabrication of polymer-based wafer-bonded capacitive micromachined ultrasonic transducers

Wafer level Tungsten-Glass bonding with photosensitive BCB

Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC)

Low temperature wafer bonding technologies

3D integration by wafer-level aligned wafer bonding

A convenient wafer level bonding based on unpatterned BCB

Similar Documents

Glass wafer mechanical properties: A comparison to silicon

Adhesive wafer bonding of GaAs/Glass with Benzocyclobutene and dry film for GaAs CCD

A New BCB Film Zero-Level Packaging for RF Devices

Solar cells by Germanium layer transfer on glass

Fabrication of polymer-based wafer-bonded capacitive micromachined ultrasonic transducers

Wafer level Tungsten-Glass bonding with photosensitive BCB

Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC)

Low temperature wafer bonding technologies

3D integration by wafer-level aligned wafer bonding

A convenient wafer level bonding based on unpatterned BCB