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2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)

2014 IEEE 18th Workshop on Signal and Power Integrity (SPI)

2013 17th IEEE Workshop on Signal and Power Integrity

2012 IEEE 16th Workshop on Signal and Power Integrity (SPI)

2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI)

2010 IEEE 14th Workshop on Signal Propagation on Interconnects

Table of contents

Session I: Interconnect modeling and system design issues

Response variability of high-speed interconnects via Hermite Polynomial Chaos

Network modeling of vertical signal interconnections in parallel reference plane structures on printed circuit boards

Benefit on interconnect performance of a relaxed wire density in a 45 nm node of the Back End of Line

Session II: Power integrity

Modeling of chip-package resonance in power distribution networks by an impulse response

Measurement of on-chip I/O power supply noise and correlation verification between noise magnitude and delay increase due to SSO

TSV-aware IDF-based power prediction for FPGA

Session III: Frequency domain simulation

Effect of mixed-reference planes on single-ended and differential links in multilayer substrates

Impact by an orthogonal metal grid upon differential- and common-mode characteristics of coupled lines in PCB technology structures

Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking

Session IV: Parameter extraction

A novel broadband boundary element approach for RL-extraction in lossy 3D interconnects

Generalization of the Barnes-Hut algorithm for rapid capacitance extraction in interconnects embedded in lossy multilayered media

Session V: Interconnect measurement and reliability

Multiport measurement and deembedding techniques for crosstalk study in via arrays

HF performance characterization and prediction of 2D redistribution layer interconnects in a 3D-integrated circuit stack

Degradation of digital signal characteristics due to intermediate stages of interconnect failure

Evaluation the moisture effects on the performance of electronic devices

Session VI: Model order reduction

Passivity-preserving parameterized model order reduction for PEEC based full wave analysis

Applicability of time domain and z-domain Vector Fitting to rational modeling from time domain responses with consideration to circuit solver integration method

Nodal order reduction via bilinear conformal transformation

Session VII: Novel interconnect technologies

Electrical and thermal behaviour of nanopackaging interconnects with conventional and innovative materials

Addressing practical issues with banded-variables in an MNA-based optoelectronic simulation framework

Modeling the ion-exchange process to support the manufacturing of optical multimode graded-index waveguides in thin glass sheets

Session VIII: Signal integrity and EMC

An application of Volterra series to IC buffer models

Performance of signal link paths in presence of signal reference planes of EBG type

Nearfield-immunity scan on printed circuit board level

Session IX: Macromodeling

Virtual-EMI lab: Removing mysteries from black-magic to a successful front-end design

Efficient passivity verification of delayed rational function macromodels from networks characterized by tabulated data

Passive delay-based macromodels for Signal Integrity verification of multi-chip links

Passive parametric macromodeling from sampled frequency data

Crosstalk mitigation enhanced by reference conductor position

Efficient evaluation of the frequency-dependent impedance matrix of full-package structures

Adaptive time-domain macromodeling algorithm for fast termination of FDTD simulations

Step response sensitivity to selected parameters of VLSI inverter — interconnect -inverter system

Measurement of on-chip transmission-line with stacked split-ring resonators

Numerical validation of a procedure for direct identification of passive linear multiport with convex programming

Crosstalk modelling and analysis of interconnects based on carbon nanotubes bundles

Reliable bounds for the propagation delay in VLSI nano interconnects based on Multi Wall Carbon Nano Tubes

2009 IEEE Workshop on Signal Propagation on Interconnects

2008 12th IEEE Workshop on Signal Propagation on Interconnects

2007 IEEE Workshop on Signal Propagation on Interconnects

2006 IEEE Workship on Signal Propagation on Interconnects

Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.

Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects

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