NDLI: Defining the safe operating area for HBTs with an InGaP emitter across temperature and current density

Content Provider	IEEE Xplore Digital Library
Author	Whitman, C.S.
Copyright Year	2006
Description	Author affiliation: RFMD, Greensboro, NC (Whitman, C.S.)
Abstract	One responsibility of the reliability engineer is to define the operating region of a component, providing designers and customers with a map of where the reliability is acceptable. This is often called the safe operating area (SOA). In this paper, SOA has been determined in terms of the FIT rate for an HBT across temperature and current density. Careful consideration was given to the temperature dependence of self-heating temperature $(T_{sh})$ in order to improve predictions. Two techniques were used to determine the confidence level on the FIT rate. These two different methods produced similar answers, giving the customer or the designer a good estimate of the margin available in the design. The procedure outlined here equips the reliability engineer with a sensible way to define the safe operating area of a device across temperature and current density. This reliability "map" furnishes the information required when choosing the operating conditions of the HBT and making compromises between current density, junction temperature and duty cycle
Sponsorship	JEDEC
Starting Page	151
Ending Page	175
File Size	4674827
Page Count	25
File Format	PDF
ISBN	0790801132
DOI	10.1109/ROCS.2006.323413
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-11-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	JEDEC
Subject Keyword	Temperature Current density Maximum likelihood estimation Voltage Heterojunction bipolar transistors Parameter estimation Reliability engineering Design engineering Semiconductor optical amplifiers Stress
Content Type	Text
Resource Type	Article

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