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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Thiel, A. Habiger, C. Thaler, M. Troster, G. |
| Copyright Year | 1995 |
| Description | Author affiliation: Electron. Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland (Thiel, A.; Habiger, C.; Thaler, M.; Troster, G.) |
| Abstract | It has become increasingly clear that electronic packaging sets important bounds on system cost and performance. As is evident from Mukund et al. (1993) and Habiger et al. (1993), WSI and hybrid WSI design has recently become a major focus of research activities. Due to its inherent interdisciplinarity a subject like WSI design or in more general electronic packaging does not easily fit into the traditional curricula of university engineering courses. The obvious needs to overcome this lack in engineering education led to the introduction of a new lecture series at ETH Zurich. This paper describes the course content and summarizes the experiences gained from this new educational approach. The major focus of the presented paper is on the description of the home- and lab-work provided additionally to the lecture series. |
| Starting Page | 72 |
| Ending Page | 81 |
| File Size | 698689 |
| Page Count | 10 |
| File Format | |
| ISBN | 0780324676 |
| DOI | 10.1109/ICWSI.1995.515440 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1995-01-18 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electronics packaging Electronic packaging thermal management Costs Laboratories Design engineering Engineering education System performance Very large scale integration Printed circuits Time to market |
| Content Type | Text |
| Resource Type | Article |
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