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| Content Provider | IEEE Xplore Digital Library | 
|---|---|
| Author | Liu, C.H. Chen, M.G. Shiang Huang-Lu Chang, Y.J. Fu, K.Y. | 
| Copyright Year | 1999 | 
| Description | Author affiliation: United Microelectron. Corp., Hsin-Chu City, Taiwan (Liu, C.H.) | 
| Abstract | Three conventional hot-carrier (HC) stress conditions (i.e. stress at Vgs/spl ap/Vth, Vgs/spl ap/Vds//sup 2/, and Vgs/spl ap/Vds) have been studied for a quarter-micrometer level surface-channel pMOSFET devices. It is shown that stress at Vgs/spl ap/Vth results in the worst-case damage, in which a "turn-around" behavior for device parameters (such as Idsat, Vth, and gm) has been observed (this is not seen in 0.35-/spl mu/m or longer p-channel devices to the best of our knowledge). This turnaround behavior could be explained by a two-step degradation model (i.e. electron trapping and charge compensation between electron trapping and interface-state generation). Moreover, similar to long-channel pMOSFET devices though the dominant degradation mechanism is somewhat different, DC device lifetime for 0.25-/spl mu/m pMOSFET devices should be evaluated using gate current as a predictor rather than substrate current that has been suggested by some researchers. | 
| Starting Page | 82 | 
| Ending Page | 85 | 
| File Size | 228110 | 
| Page Count | 4 | 
| File Format | |
| ISBN | 0780356209 | 
| DOI | 10.1109/VTSA.1999.786005 | 
| Language | English | 
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) | 
| Publisher Date | 1999-06-10 | 
| Publisher Place | Taiwan | 
| Access Restriction | Subscribed | 
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) | 
| Subject Keyword | Hot carriers Degradation MOSFET circuits Stress Electron traps Interface states Cause effect analysis Hot carrier effects | 
| Content Type | Text | 
| Resource Type | Article | 
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