NDLI: Mechanism of AC electromigration

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Electromigration in a two-level Al-Cu interconnection with W studs

Effects of contact hole filling and multilevel metallization on gate oxide integrity and transistor performance

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1990 Proceedings. Seventh International IEEE VLSI Multilevel Interconnection Conference (Cat. No.90TH0325-1)

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1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference

Mechanism of AC electromigration

Content Provider	IEEE Xplore Digital Library
Author	Shono, K. Kuroki, T. Sekiya, H. Yamada, N.
Copyright Year	1990
Description	Author affiliation: Fujitsu Ltd., Kawasaki, Japan (Shono, K.; Kuroki, T.; Sekiya, H.; Yamada, N.)
Abstract	A model for the mechanism of AC electromigration based on the thermal response of Al stripes is proposed. The model is based on the temperature difference between the positive period and the negative period. The thermal time constant of the Al stripe, underlying SiO/sub 2/, and Si substrate is on the order of microseconds and that of the package and ambient is a few seconds. When the cycle time of the current is longer than thermal time constant, the temperature of the Al stripes obeys the current waveform. When the cycle time is shorter than the thermal time constant, the temperature keeps constant. Mean time to failure (MTF) depends on the temperature according to Arrhenius's equation. The temperature difference between positive and negative periods causes an unbalance of atomic flux between the periods. Thus, open-circuit failure can take place under AC conditions.
Starting Page	99
Ending Page	105
File Size	249963
Page Count	7
File Format	PDF
DOI	10.1109/VMIC.1990.127851
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-06-12
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromigration Thermal resistance Temperature Circuit testing Current density Packaging Integrated circuit modeling Frequency Performance evaluation Power dissipation
Content Type	Text
Resource Type	Article

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