NDLI: Thick film/flip chips—A systems approach

Content Provider	IEEE Xplore Digital Library
Author	Early, R.C.
Copyright Year	1975
Description	Author affiliation: General Electric Company, Lynchburg, Virginia (Early, R.C.)
Abstract	This paper deals with the thick-film hybrid integrated circuit process currently being used to realize complex circuit functions in hybrid form. The thick-film technology, active device attachment, and packaging all play important roles in the overall systems approach. A description of the various processes will be presented starting with the ceramic substrate and ending with the completed package. Extensive use is made of computer-controlled laser trimming for both static trimming of resistors and functional trimming of modules after assembly. When properly used, the laser is a powerful tool. Active devices are attached using a solder-reflow technique. All of the connections on the active devices are terminated using solder bumps connsisting of a tin/lead alloy. There are corresponding land areas on the ceramic substrate that have been coated with a tin/lead solder. The land areas on the substrate are designed in such a way as to restrict the solder wetting to the small area around the terminal similar to the IBM, "controlled collapse" process. The techniques employed result in thick-film hybrid integrated circuits that are economical, reliable, high in yield, and offer considerable flexibility to the hybrid manufacturer.
Starting Page	57
Ending Page	64
File Size	886459
Page Count	8
File Format	PDF
DOI	10.1109/VTC.1975.1622264
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1975-01-21
Publisher Place	Canada
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thick films Substrates Hybrid integrated circuits Integrated circuit packaging Ceramics Tin Lead Integrated circuit technology Resistors Assembly
Content Type	Text
Resource Type	Article

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