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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Mishra, R. Mitra, S. Gauthier, R. Ioannou, D.E. Kontos, D. Chatty, K. Seguin, C. Halbach, R. |
| Copyright Year | 2007 |
| Description | Author affiliation: George Mason Univ., Fairfax, VA (Mishra, R.) |
| Abstract | A comprehensive study on the interaction between ESD, NBTI and HCI on silicide blocked (SBLK) PFET devices is presented for a state-of-the-art 65nm bulk technology. ESD behavior of thin and thick oxide devices are shown to have opposite channel length dependence. The study of NBTI-ESD interaction on thin oxides devices shows that non-destructive ESD pre-stressing worsens the NBTI degradation. On the other hand NBTI pre-stressed thick oxide devices show high on-resistance during ESD characterization. It is shown that in thin oxide long channel length devices at high temperature pure NBTI is the worst case degradation mode whereas in short channel length devices combined "HC-NBTI" degradation dominates. Furthermore, we observed that while a SBLK PFET is HC stressed at high temperature then NBTI also takes place simultaneously, resulting in "HC-NBTI" co-activation, which is found to be channel length dependent. Finally, we have shown that HC degradation is worse at high temperature than at room temperatures due to this NBTI co-activation. |
| Starting Page | 17 |
| Ending Page | 22 |
| File Size | 312608 |
| Page Count | 6 |
| File Format | |
| ISBN | 1424409187 |
| DOI | 10.1109/RELPHY.2007.369862 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-04-15 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electrostatic discharge Niobium compounds Titanium compounds Human computer interaction Degradation Stress Silicides Temperature dependence Hot carriers Driver circuits Interaction ESD NBTI HCI |
| Content Type | Text |
| Resource Type | Article |
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