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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Dycus, Dale W. |
| Copyright Year | 1980 |
| Description | Author affiliation: MOSTEK CORPORATION, 1215 West Crosby, Carrollton, Texas 75006 (Dycus, Dale W.) |
| Abstract | Plastic molding compounds show two major moisture uptake rates, one fast and one slow. The fast rate represents the moisture uptake mechanism that is responsible for moisture dependent failures in epoxy novolac plastics. It is felt that the fast rate represents transport through the organic epoxy matrix by hydrogen bonding. Silicone epoxy shows a much slower rate of moisture uptake after an initial induction period. The moisture dependent failure is therefore controlled by the slower rate in silicone epoxy. The slower rate is thought to be uptake by the silica filler matrix. |
| Starting Page | 293 |
| Ending Page | 300 |
| File Size | 5923115 |
| Page Count | 8 |
| File Format | |
| ISSN | 07350791 |
| DOI | 10.1109/IRPS.1980.362956 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1980-04-08 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electronics packaging Active matrix organic light emitting diodes Hydrogen Bonding Silicon compounds Plastic packaging Moisture control Predictive models Stress Testing |
| Content Type | Text |
| Resource Type | Article |
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