NDLI: Evolution of a High-Reliability Molded DIP

Content Provider	IEEE Xplore Digital Library
Author	Beard, Robert
Copyright Year	1972
Description	Author affiliation: National Semiconductor Corporation, 2900 Semiconductor Way, Santa Clara, California 95051 (Beard, Robert)
Abstract	An investigation of the effects of package. structures upon IC failure rates led to the development of a new molded DIP (dual in-line package) with exceptional reliability. The design, which is being put into production, rivals hermetic packages in mechanical and environmental reliability. The study began as an effort to reduce the initial thermal intermittent and temperature cycle reject rates encountered during production testing of industrial IC's packaged in silicone DIPs. The DIP used has a rigid body, but before molding of the body the die is coated with an elastomer to provide added moisture resistance and mechanical buffering. While generally more reliable than earlier DIP designs, this structure still allowed stressing of the wire bonds during temperature cycling and was not as resistant to salt atmosphere as epoxy packages. Also, the need for a die coat had become questionable since current practice is to "glass" the chips during wafer processing. Study of the problem, with optimized bonds, led to the theory that a solid, highly compressive body could be more reliable. Silicone and epoxy models with and without die coats where tested. Data were gathered on the effects of mold shrinkage upon thermal intermittent failure rates and upon ball bond and stitch bond failures during temperature cycling. Also, the effect of glass transition temperature upon failure rate was studied (at Tg, rate of change in thermal expansion coefficient of a plastic icreases markedly).
Starting Page	72
Ending Page	77
File Size	5772026
Page Count	6
File Format	PDF
ISSN	07350791
DOI	10.1109/IRPS.1972.362530
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1972-04-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Temperature Integrated circuit packaging Production Testing Immune system Glass Moisture Wire Atmosphere
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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