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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Bazu, M. Tazlauanu, M. |
| Copyright Year | 1991 |
| Description | Author affiliation: R&D Inst. for Electron. Components, Bucharest, Romania (Bazu, M.; Tazlauanu, M.) |
| Abstract | The influence of the humidity on semiconductor device reliability is investigated in order to emphasize the role of the humidity in the failure process as a stress factor and to model the reliability-humidity relationship. Experiments were performed on two types of plastic-encapsulated semiconductor devices (optoelectronic and ICs). Reliability data obtained from functioning at humidity and temperature are compared with those obtained from functioning at the same temperatures, but at a lower humidity level. The role of the humidity as a stress factor is made obvious by identifying the specific failure mechanisms induced. The experimental data are used for the validation of an original model, a generalized Arrhenius relation. The model allows the design of accelerated tests with humidity as one of the stress factors. A comparison of the model with previous models is given. |
| Starting Page | 307 |
| Ending Page | 311 |
| File Size | 239286 |
| Page Count | 5 |
| File Format | |
| ISBN | 0879426616 |
| DOI | 10.1109/ARMS.1991.154453 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1991-01-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Semiconductor device reliability Semiconductor device testing Semiconductor devices Humidity Failure analysis Stress Temperature Plastics Optical microscopy Metallization |
| Content Type | Text |
| Resource Type | Article |
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