NDLI: Design and characterization of CPW feedthroughs in multi-layer thin-film MCM-D

Content Provider	IEEE Xplore Digital Library
Author	Carchon, G. Di Monaco, O. Vaesen, K. Brebels, S. De Raedt, W. Nauwelaers, B.
Copyright Year	2000
Description	Author affiliation: div. ESAT-TELEMIC, Katholieke Univ., Leuven, Belgium (Carchon, G.)
Abstract	We report on the design and characterization of CPW feedthroughs in multi-layer thin-film MCM-D. Using 3-D simulations, it is shown that, for analysis purposes, the vertical metal wall, can be replaced with a thin (5 /spl mu/m) metal layer with only a small impact on the actual performance. This equivalent structure can be more easily fabricated as the thin metal layer on the top is directly available in the multi-layer technology. This allows for a faster design and characterization of the feedthrough. The transmission line properties (characteristic impedance and propagation constant) of the intrinsic feedthrough are extracted based on the measurement of two equivalent lines with different length. Measurements indicate that a low-loss (<0.4 dB), well matched feedthrough (return loss below -25 dB) can be realized up to at least 50 GHz (feedthrough length of 500 /spl mu/m).
Starting Page	167
Ending Page	170
File Size	432070
Page Count	4
File Format	PDF
ISBN	0780362675
DOI	10.1109/RAWCON.2000.881881
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-09-13
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Coplanar waveguides Transistors Dielectric losses Dielectric substrates Costs Circuits Impedance Transmission line measurements Spirals Packaging
Content Type	Text
Resource Type	Article

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