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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Engelmann, G. Senoner, T. van Hoek, H. De Doncker, R.W. |
| Copyright Year | 2015 |
| Description | Author affiliation: Inst. for Power Electron. & Electr. Drives, RWTH Aachen Univ., Aachen, Germany (Engelmann, G.; Senoner, T.; van Hoek, H.; De Doncker, R.W.) |
| Abstract | Increasing power densities of power electronics with reduced volume requires increased efforts in cooling as little surface and material are available for thermal conduction. A systematic comparison of the thermal resistance of a wide selection of thermal interface materials (TIMs) ranging from solid $Al_{2}O_{3}$ to elastomeric interface materials as well as thermal greases is investigated in this work. In contrast to the ideal testing conditions used by the TIM manufacturers, a practical application setup using a surface-mounted MOSFET $(DirectFET^{TM})$ pressed on a heatsink is used. Thereby, additional influences on the thermal resistance due to surface finish or non-homogeneous pressure are considered in the results. The effective contacting area as well as different pressure levels are investigated. On the basis of a B6C converter bridge, it will be shown, how the proper choice of TIM affects the mechanical and thermal design of a converter. |
| Starting Page | 112 |
| Ending Page | 117 |
| File Size | 5380408 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781479944026 |
| ISSN | 21645264 |
| DOI | 10.1109/PEDS.2015.7203496 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-06-09 |
| Publisher Place | Australia |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal resistance Thermal conductivity Temperature measurement Electrical resistance measurement Heating Pressure measurement |
| Content Type | Text |
| Resource Type | Article |
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