NDLI: Full chip thermal simulation

Content Provider	IEEE Xplore Digital Library
Author	Yu, Z. Yergeau, D. Dutton, R.W.
Copyright Year	2000
Description	Author affiliation: Center for Integrated Syst., Stanford Univ., CA, USA (Yu, Z.)
Abstract	A multilayer, full chip thermal analysis is presented. The design of the chip at functional-block level is directly captured by the simulator, allowing the assessment of the chip layout impact on the system performance due to the elevated operational temperature. The heat generation for each block is obtained by running the circuit-level electrical simulation separately on individual functional units. The thermal diffusion equation is then solved based on the actual structure of the chip including substrate and interconnect/insulating layers. Different thermal conductivity can be specified for each material layer. The effect of package on chip temperature distribution is modeled using thermally resistive layers as the boundary between the simulated structure and surrounding environment. Proper adjustment of the boundary thermal resistance results in the correct range of simulated temperature distribution as compared to the measured data. Both physics and implementation for the thermal simulation are described. The code is applied to the analysis of a realistic design of a CPU chip made of SOI technology with up to six metal interconnect layers. A comprehensive review of the simulation results is presented.
Starting Page	145
Ending Page	149
File Size	182164
Page Count	5
File Format	PDF
ISBN	0769505252
DOI	10.1109/ISQED.2000.838867
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-03-22
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal resistance Circuit simulation Integrated circuit interconnections Thermal conductivity Temperature distribution Nonhomogeneous media System performance Equations Insulation Conducting materials
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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