NDLI: Development of high current transfer-mold type power module with high heat-cycle durability [motor drive applications]

Content Provider	IEEE Xplore Digital Library
Author	Sasaki, T. Takao, H. Shikano, T. Fujita, S. Nakajima, D. Shinohara, T.
Copyright Year	2004
Description	Author affiliation: Fukuryo Semicon Eng. Co, Fukuoka, Japan (Sasaki, T.; Takao, H.; Shikano, T.; Fujita, S.)
Abstract	High current transfer-molded type power modules have been developed for industrial motor drive systems. The key issue in this development was to improve the heat dissipation characteristics of the existing transfer-molded package construction. To achieve this, a new concept of directly soldering power chips onto heat spreaders has been adopted. However, the strain on solder joints by heat-cycling stress became an issue in the development process. It has been solved by creating specially designed dimples on copper heat spreaders integrated in the structure and using a new resin, which has a linear expansion coefficient close to that of the metal. The durability of a new transfer molded type high-current power module, which has been developed based on the novel structural concept, has been ascertained by heat cycling and other tests. In this paper, the authors describe some major aspects of the new design and provide results of confirmatory tests performed on the device.
Sponsorship	Inst. of Elec. Eng., Japan IEEE
Starting Page	293
Ending Page	296
File Size	220125
Page Count	4
File Format	PDF
ISBN	4886860605
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-24
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Inst. of Electrical Engineers of Japan
Subject Keyword	Power electronics Motor drives Cooling Stress
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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