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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Sun, J.Y.-C. Angelucci, R. Wong, C.Y Scilla, G. Landi, E. |
| Copyright Year | 1988 |
| Description | Author affiliation: IBM Research Division, Thomas J. Watson Research Center, PO Box 218, Yorktown Heights NY 10598, U.S.A. (Sun, J.Y.-C.; Angelucci, R.; Wong, C.Y; Scilla, G.) || CNR-LAMEL Institute, I-40126 Bologna, Italy (Landi, E.) |
| Abstract | We demonstrated the feasibility and advantages of using rapid thermal annealing (RTA) to achieve a proper work-function for arsenic-implanted polysilicon gate on 7 nm SiO in a dual work function $(n^{+}$ and $p^{+})$ poly-gate CMOS process. Interface states and fixed oxide charge due to RTA can be annealed out at 500°C in forming gas. Time-zero and time-dependent breakdown results show that the integrity of 7 nm gate oxide can be preserved after RTA. The diffusivity of arsenic in polysilicon under RTA is found to be consistent with literature data from conventional furnace anneals. |
| File Size | 1591968 |
| File Format | |
| ISBN | 2868830994 |
| ISSN | 04491947 |
| DOI | 10.1051/jphyscol:1988484 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1988-09-13 |
| Publisher Place | France |
| Access Restriction | Subscribed |
| Rights Holder | Les Editions de Physique |
| Subject Keyword | Rapid thermal processing CMOS process Furnaces Rapid thermal annealing Interface states Electric breakdown Ion implantation Atmospheric measurements Breakdown voltage Current measurement |
| Content Type | Text |
| Resource Type | Article |
| Subject | Engineering |
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