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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tae-Hwa Lee Jong-Hyuk Park Jong-Uk Kim Han-Goo Cho |
| Copyright Year | 2013 |
| Description | Author affiliation: Korea Electrotechnol. Res. Inst., Chang-Won, South Korea (Tae-Hwa Lee; Jong-Hyuk Park; Jong-Uk Kim; Han-Goo Cho) |
| Abstract | In recent times, there has been an ever-growing need for epoxy based materials for electronic packaging applications. The aim of this study is to improve both thermal and electrical insulation properties of epoxy based composites using micro and nanocomposite techniques. This paper deals with the effect of adding micro and nano scale aluminum nitride on thermal and electrical properties of epoxy/silica microcomposite. Two kinds of specimens were prepared with containing micro and nano-fillers as a micro-composite and nano-composite. Experiments were carried out in epoxy composites with the particle dispersion techniques by applying ultrasonic wave and centrifugal force. Average particle sizes of the aluminum nitride used were 20um and 40nm. The content of powder in the samples was varied from 0.5 to 20 % by weight. The dispersion of aluminum nitride micro-, nano-particles and the morphology of the micro-, nano-composite samples were investigated by means of field emission scanning electronic microscopy (FE-SEM). The different models for predicting the thermal conductivity for two phase system are compared with experimental data of micro- and nano-sized aluminum nitride particles filled epoxy composite. |
| Starting Page | 927 |
| Ending Page | 930 |
| File Size | 748894 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479908073 |
| ISSN | 15535282 |
| e-ISBN | 9781467344616 |
| DOI | 10.1109/ICSD.2013.6619693 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-06-30 |
| Publisher Place | Italy |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal conductivity III-V semiconductor materials Conductivity Power transformer insulation Thermal analysis Dielectric breakdown epoxy AlN microcomposite nanocomposite thrtmal consuctivity |
| Content Type | Text |
| Resource Type | Article |
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