Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Simon, B.R. Yuan, Y. Umaretiya, J.R. Prince, J.L. Staszak, Z.J. |
| Copyright Year | 1989 |
| Description | Author affiliation: Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA (Simon, B.R.; Yuan, Y.; Umaretiya, J.R.) |
| Abstract | The authors present a parametric study of thermal stresses in plastic packages that are induced during the die attachment and encapsulation fabrication steps. Finite-element models (FEMs) of plastic VLSI packages were used to vary package design parameters (die thickness, die bond materials and thickness, lead frame thickness, and package thickness and width/length) over typical ranges. Areas of complexity were considered in more detail using local finite-element analysis. The loss of adhesion between the mold and the die and/or lead frame in the package was simulated using gap finite elements in order to consider the extreme cases of no slip or no adhesion at these material interfaces. Changes in die thickness, die bond thickness, and package thickness caused significant changes in package thermal stresses, whereas changes in lead frame thickness, package width/length and die bond elastic modulus corresponded to minor changes in package stresses. The loss of adhesion at the mold material interface resulted in significantly altered thermal stress fields, e.g. the stresses were concentrated near the corners of the chip and lead frame where cracking has been observed in DIP plastic molding materials. |
| Starting Page | 52 |
| Ending Page | 58 |
| File Size | 514955 |
| Page Count | 7 |
| File Format | |
| DOI | 10.1109/STHERM.1989.76066 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1989-02-07 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Parametric study Very large scale integration Plastic packaging Thermal stresses Finite element methods Bonding Adhesives Encapsulation Fabrication Electronics packaging |
| Content Type | Text |
| Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|