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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Celik, Z.Z. |
| Copyright Year | 1998 |
| Description | Author affiliation: LSI Logic Corp., Fremont, CA, USA (Celik, Z.Z.) |
| Abstract | Elliptical fin heat sinks with different fin heights and base areas were selected for experimental evaluation with 45 mm/spl times/45 mm enhanced plastic ball grid array (EPBGA) packages. They were tested to determine the thermal enhancement in terms of junction-to-air thermal resistance at velocities ranging from 0 m/s to 3 m/s in the LSI closed circuit wind tunnel. It was observed that the maximum variation in junction-to-air resistance is a function of fin height and heat sink base area as well as air velocity. Thermal performance was greatly affected by the orientation of heat sinks with the same surface area. Empirical equations which predict the loci of maximum variation for a given base area were developed. |
| Starting Page | 63 |
| Ending Page | 67 |
| File Size | 382650 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780344863 |
| ISSN | 10652221 |
| DOI | 10.1109/STHERM.1998.660389 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1998-03-10 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Heat sinks Circuit testing Large scale integration Plastic packaging Thermal resistance Thermal conductivity Electronics packaging Temperature sensors Temperature measurement Logic arrays |
| Content Type | Text |
| Resource Type | Article |
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