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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Billings, D. Stout, R.P. |
| Copyright Year | 1995 |
| Description | Author affiliation: LATG Thermal Characterization Lab., Motorola Inc., Tempe, AZ, USA (Billings, D.; Stout, R.P.) |
| Abstract | In a growing number of customer applications, the ultimate success of a semiconductor package design is measured by its thermal performance. Unfortunately, thermal databases consisting of junction-to-ambient thermal resistance (/spl theta//sub ja/) alone fall short of allowing the customer to adequately predict the actual thermal performance of a package, since the actual /spl theta//sub ja/ of a package is sensitive in varying degrees to the details of the system board on which the package is mounted. Though this fact is often acknowledged, the magnitude of the effect is generally not appreciated, and it is rare to find sufficient information in a product data sheet to allow such an evaluation. Variations in thickness and coverage of signal traces, power and ground planes, and insulating layers, can change the nominal /spl theta//sub ja/ of a package by from 25 to 50%. To illustrate this effect, several non-thermally enhanced Quad Flat Pack (QFP) type packages were mounted on several types and sizes of test boards, which were then both measured and modeled. Changes in overall /spl theta//sub ja/ are correlated with the metal content of the boards. |
| Starting Page | 31 |
| Ending Page | 36 |
| File Size | 621404 |
| Page Count | 6 |
| File Format | |
| ISBN | 078032434X |
| ISSN | 10652221 |
| DOI | 10.1109/STHERM.1995.512048 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1995-02-07 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal resistance Semiconductor device packaging Electronics packaging Testing Electrical resistance measurement Temperature Wind speed Databases Insulation Power measurement |
| Content Type | Text |
| Resource Type | Article |
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