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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Miyashita, N. Tamaki, K. Tsuchiyama, H. Uchida, N. Sakai, K. Yamamoto, K. |
| Copyright Year | 2010 |
| Description | Author affiliation: Renesas Electronics Corp., 292 Yoshida-cho, Totsuka-ku, Yokohama 244-0817, Japan (Tsuchiyama, H.; Uchida, N.; Sakai, K.; Yamamoto, K.) || Hitachi Ltd., 292 Yoshida-cho, Totsuka-ku, Yokohama 244-0817, Japan (Miyashita, N.; Tamaki, K.) |
| Abstract | This paper presents a novel Cu-CMP APC that compensates the high-speed drift of thinning amount during the continuous input of high-mix products. Compensation is realized by estimating the polishing rate as the summation of the estimated standard drift and the amount of shift for each product group. A new algorithm in which the products with similar rates are systematically grouped has also been developed. Numerical simulations have demonstrated that application of the novel APC to SoC products reduced the 3σ of the thinning amount by 60.0%. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 1565179 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781457703928 |
| ISSN | 1523553X |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-10-18 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | ISSM |
| Subject Keyword | Production Metrology |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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