NDLI: Thick metal plate insertion make FR4 multilayer board a simple carrier for RF power circuits

Content Provider	IEEE Xplore Digital Library
Author	Buoli, Carlo Biffi, Giovanni Turillo, Tommaso Zingirian, Alessandro
Copyright Year	2001
Description	Author affiliation: Siemens Information and Communication Networks S.p.A., Strada Padana Superiore Km158 20060, Cassina de Pecchi - MILANO. e-mail: Tommaso.Turillo@icn.siemens.it (Turillo, Tommaso) \|\| Siemens Information and Communication Networks S.p.A., Strada Padana Superiore Km158 20060, Cassina de Pecchi - MILANO. e-mail: Carlo.Buoli@icn.siemens.it (Buoli, Carlo) \|\| Siemens Information and Communication Networks S.p.A., Strada Padana Superiore Km158 20060, Cassina de Pecchi - MILANO. e-mail: Giovanni_Ivano.Biffi@icn.siemens.it (Biffi, Giovanni) \|\| Siemens Information and Communication Networks S.p.A., Strada Padana Superiore Km158 20060, Cassina de Pecchi - MILANO. e-mail: Alessandro.Zingirian@icn.siemens.it (Zingirian, Alessandro)
Abstract	In order to reduce sizes and costs of microwave circuits and to simplify their integration together with IF, control and power supply networks, we tested (1) a simple solution that allows using FR4 boards also for microwave circuits. Since FR4 boards are necessarily present in every equipment for power supplies, control, digital and IF circuits, it becomes possible to reduce the number of boards or modules collecting all the networks (operating from DC to tenth of Gigahertz) on the same FR4 multilayer. The typical RF requirements of good thermal and electrical ground and the need of a carrier for "chip on board" monolithic assembly are all achieved through the insertion of a copper plate a few tenth of millimetre thick. This copper plate replaces the second metal layer of FR4 multilayer remaining within standard FR4 process; monolithics can be mounted on it just opening a window on the first layer.
Starting Page	1
Ending Page	4
File Size	3421135
Page Count	4
File Format	PDF
DOI	10.1109/EUMA.2001.339162
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-09-24
Publisher Place	England
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Nonhomogeneous media Radio frequency Microwave devices Microwave circuits Power supplies Circuit testing Copper Costs Size control Digital control
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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