NDLI: Three dimensional imaging of microelectronic devices using a crossbeam FIB

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2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits

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Testing of ultra low voltage CMOS microprocessors using the superconducting single-photon detector (SSPD)

Three dimensional imaging of microelectronic devices using a crossbeam FIB

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Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Three dimensional imaging of microelectronic devices using a crossbeam FIB

Content Provider	IEEE Xplore Digital Library
Author	Lifshin, E. Evertsen, J. Principe, E. Friel, J.
Copyright Year	2005
Description	Author affiliation: Coll. of Nanoscale Sci. & Eng., SUNY at Albany, NY, USA (Lifshin, E.; Evertsen, J.)
Abstract	These experiments were performed using a Carl Zeiss 1540 crossbeam instrument that permits SEM imaging during ion milling. The FIB beam consists of 30 KV Ga ions with currents ranging from several nanoamperes down to several picoamperes. The Schottky source electron gun was run in the high current mode at 1 and 5 KV to provide an electron beam current of about 2nA. Much of the surrounding material is removed to allow for better viewing and expose the faced used to start the milling. The FIB was then set to mill through the entire region with the SEM set to capture a secondary electron image of the freshly exposed surface every 10 seconds. After these images are created they can be orientated and manipulated to provide a view of any part of the volume including slicing the volume from any arbitrary direction. After the image is collected the sample is reoriented back to the milling position. This process is repeated until the region of interest is fully eroded.
File Size	464344
File Format	PDF
ISBN	0780393015
DOI	10.1109/IPFA.2005.1469120
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-06-27
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microelectronics Scanning electron microscopy Milling Copper Electron beams Image reconstruction Face detection Optical imaging Educational institutions Knowledge engineering
Content Type	Text
Resource Type	Article

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