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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jun-Kai Wang Ren-Fang Hsu Wen-Te Chien Sung-Mao Wu Cheng-Chang Chen Ming-Shan Lin |
| Copyright Year | 2013 |
| Description | Author affiliation: Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan (Jun-Kai Wang; Ren-Fang Hsu; Wen-Te Chien; Sung-Mao Wu) || Bur. of Stand., Metrol. & Inspection, Minist. of Econ. Affairs, Taiwan (Cheng-Chang Chen; Ming-Shan Lin) |
| Abstract | In order to solve the problem of process and cost in 3D-IC, novel non-contact signal transmission with coupling loops have been presented. In this study, we design the broadband, well reproducibility, well directivity and low loss coupling loops to transmit signal between different chips or ICs in 3DIC application, and establishing physical model up to 10GHz with coupling effect and loop effect to restore the signal radiation. By this method, the overall signal transmission of TSV can be the same as the non-contact technology. People can use this design to replace the TSV technology in the future. |
| Sponsorship | IEEE Microw. Theory Tech. Soc. |
| Starting Page | 827 |
| Ending Page | 829 |
| File Size | 988595 |
| Page Count | 3 |
| File Format | |
| ISBN | 9781479914722 |
| DOI | 10.1109/APMC.2013.6694946 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-11-05 |
| Publisher Place | South Korea |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Couplings Loss measurement Microwave theory and techniques Capacitance Broadband communication Through-silicon vias Coplanar waveguides 3DIC Non-contact Signal transmission Radiation model TSV |
| Content Type | Text |
| Resource Type | Article |
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