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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Moffat, D. Barnes, P. Kirchgessner, J. Padamsee, H. Potts, J. Rubin, D. Sears, J. Shu, Q. Proch, D. |
| Copyright Year | 1991 |
| Description | Author affiliation: Lab. of Nucl. Studies, Cornell Univ., Ithaca, NY, USA (Moffat, D.; Barnes, P.; Kirchgessner, J.; Padamsee, H.; Potts, J.; Rubin, D.; Sears, J.; Shu, Q.) |
| Abstract | The authors have systematically studied the effect on R/sub s/ (surface resistance) of several different acid mixtures and the conditions of their use. Reverse electropolishing, which generates large quantities of hydrogen at the niobium surface, can drastically increase R/sub s/. R/sub s/ can be decreased by subsequent heat treatment for 2 h at 200-300 degrees C, indicating that the hydrogen is concentrated in a thin surface layer. This was confirmed by RRR (residual resistance ratio) measurements on thin samples. Etching niobium with 1:1:1 buffered chemical polish under open conditions, i.e., copious amounts of room temperature acid with hydrogen, does not seriously load a sample with hydrogen. Using the same acid under closed conditions, i.e. restricted flow of acid which leads to a substantial increase in temperature, can increase R/sub s/ significantly. A 1:1:4 LCP acid mixture, in which phosphoric acid is replaced by lactic acid, does not introduce hydrogen under closed conditions. This mixture can even remove the hydrogen-enriched layer in a previously contaminated sample, restoring R/sub s/ to its theoretical value. Vacuum heat treatment for 2 h at 900 degrees C removes all dissolved hydrogen and restores R/sub s/. |
| Starting Page | 2414 |
| Ending Page | 2416 |
| File Size | 283476 |
| Page Count | 3 |
| File Format | |
| ISBN | 0780301358 |
| DOI | 10.1109/PAC.1991.164984 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1991-05-06 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Surface resistance Radio frequency Niobium Hydrogen Surface treatment Heat treatment Temperature Electrical resistance measurement Pollution measurement Etching |
| Content Type | Text |
| Resource Type | Article |
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